hackrf/hardware/hackrf-one
2021-10-05 17:11:15 -06:00
..
acrylic_case Removed old SoB directory; added new 'acrylic_case' directory 2019-12-09 16:31:40 -07:00
PlasticCase_CAD Removed old SoB directory; added new 'acrylic_case' directory 2019-12-09 16:31:40 -07:00
baseband.sch HackRF One: Update documentation 2021-09-28 10:12:28 -06:00
fp-lib-table HackRF One: updated for compatibility with KiCad 4.0.2 2016-07-14 14:24:09 -06:00
frontend.sch HackRF One: Update documentation 2021-09-28 10:12:28 -06:00
hackrf-one-cache.lib HackRF One: Update documentation 2021-09-28 10:12:28 -06:00
hackrf-one.cmp adopt OSHWA convention for SPI signal names 2020-07-03 16:37:15 -06:00
hackrf-one.kicad_pcb HackRF One: Change fabrication attr for U4, 17-19, 21 to SMT 2021-10-05 17:11:15 -06:00
hackrf-one.pro HackRF One: update to KiCad 5.1 2020-10-13 22:21:31 +01:00
hackrf-one.sch HackRF One: Update documentation 2021-09-28 10:12:28 -06:00
LICENSE HackRF One: update license to CERN-OHL-P v2 2020-10-13 22:22:02 +01:00
mcu.sch Adjust pin strapping to indicate revision increment. 2021-09-28 13:56:13 -06:00
README HackRF One: add impedance requirement 2020-10-13 22:22:02 +01:00
sym-lib-table HackRF One: update to KiCad 5.1 2020-10-13 22:21:31 +01:00

Copyright 2012, 2013, 2014 Michael Ossmann

These files are part of HackRF.

This is a free hardware design; you can redistribute it and/or modify
it under the terms of the GNU General Public License as published by
the Free Software Foundation; either version 2, or (at your option)
any later version.

This design is distributed in the hope that it will be useful,
but WITHOUT ANY WARRANTY; without even the implied warranty of
MERCHANTABILITY or FITNESS FOR A PARTICULAR PURPOSE.  See the
GNU General Public License for more details.

You should have received a copy of the GNU General Public License
along with this design; see the file COPYING.  If not, write to
the Free Software Foundation, Inc., 51 Franklin Street,
Boston, MA 02110-1301, USA.


HackRF One is a wideband software radio transceiver with a USB interface.

hardware notes:

Schematic and layout files were designed in KiCad, an open source electronic
design automation package.

order of copper layers:
    Copper 1:  C1F (front)
    Copper 2:  C2
    Copper 3:  C3
    Copper 4:  C4B (back)

PCB description: 4 layer PCB 0.062 in
    Copper        1   0.5 oz foil plated to approximately 0.0017 in
    Dielectric  1-2   0.0119 in
    Copper        2   1 oz foil (0.0014 in)
    Dielectric  2-3   0.0280 in
    Copper        3   1 oz foil (0.0014 in)
    Dielectric  3-4   0.0119 in
    Copper        4   0.5 oz foil plated to approximately 0.0017 in

FR4 or similar substrate with Er=4.5 (+/- 0.1)
required impedance: 50 ohm (+/- 5%) 20 mil microstrip impedance
double side solder mask green
single side silkscreen white
6 mil min trace width and
6 mil min isolation